SemiConductor Devices

FPA Hybridization

Flip chip bonding is the ultimate technique for the hybridization of large format sensing arrays to silicon Read Out Integrated Circuit (ROIC) chips. About 20 years' of experience in Focal Plane Array (FPA) hybridization for cooled detectors makes SCD one of the leaders in the field. Our well-developed processes of indium bump deposition, reflow processing, and flip chip bonding, enable the fabrication of large format FPA detectors with pitches down to 10 m. After hybridization of the FPA, the space between indium bumps is filled with a polymer (under-fill technique), giving mechanical strength to the FPA. The FPA is mounted onto a customized ceramic substrate (mounted FPA sub-assembly) with excellent thermal anchoring to the cold finger of the Dewar. The sub-assembly can also be supplied separately for direct incorporation into the customer’s own Dewar.

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