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    Spatial and spectral filtering of focal plane arrays

    This article describes new imaging capabilities and technologies developed for infrared focal plane arrays (FPAs) at SCD. One of the new technologies is the patterning of the back surface of the FPA, whose front surface is bonded to a silicon readout integrated circuit (ROIC). Another is the hybridization of a spectral filter to the same back surface. Increased image resolution has been achieved by using an opaque mask on the backside of the FPA with small central apertures. The reduced fill factor of the sensor leads to lower crosstalk between neighboring pixels and a higher Nyquist frequency. A highly detailed...
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    • Yoram Karni
    • Michal Nitzani
    • Eli Jacobsohn
    • Ilana Grimberg
    • Sivan Gliksman
    • Avihoo Giladi
    • Leonid Krasovitski
    • Eran Avnon
    • Itay Hirsh
    • Leonid Bikov
    • Inna Lukomsky
    • Lior Shkedy
    • Rami Fraenkel
    • Itay Shtrichman
    • Pilar Gonzalez
    • Andy Lambrechts

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